5G推进导电屏蔽材料模切和导热资料及器件需求快速提升：5G智能手机传输速率、频率、信号强度等显著提升，从中心芯片到射频器件、从机身体质到内部构造，零部件将迎来新的革新，对电磁屏蔽和导热提出更高请求，将来电磁屏蔽与导热产品有望进一步呈现多元化、工艺晋级、单机用量提升等趋向，具备更宽广的的生长空间。依据第三方预测，全球EMI/RFI屏蔽资料市场范围将于2021年达78亿美圆，界面导热资料将于2020年达11亿美圆范围，而属于新兴行业的石墨散热资料，在消费电子范畴的市场范围已达近百亿元钱。随着5G时期下游市场的快速开展，单机需求量的提升叠加终端设备数量的增加，将带来电磁屏蔽和导热资料和器件的宏大增量需求，因而我们以为2021年以后，电磁屏蔽与导热资料市场有望完成更快速的增长。
5G promotes the rapid increase in the demand for conductive shielding material die-cutting and thermal conductivity data and devices: 5G smart phone transmission rate, frequency, signal strength and other significantly improved, from the center chip to the radio frequency device, from the body constitution to the internal structure, parts will usher in new innovations, electromagnetic shielding and heat conduction put forward higher requirements, the future electromagnetic shielding and heat conduction products are expected to further show diversification, process promotion, single-unit consumption increase and other trends. Have a broader growth space. According to third-party forecasts, the global EMI/RFI shielding data market will reach $7.8 billion in 2021, the interface heat transfer data will reach $1.1 billion in 2020, and the graphite heat dissipation data of the emerging industry has reached 10 billion yuan in the market scope of consumer electronics. With the rapid development of the downstream market in the 5G period, the increase in the demand for single machines and the increase in the number of terminal devices will bring about the great incremental demand for electromagnetic shielding and thermal conductivity data and devices, so we think that after 2021, the electromagnetic shielding and thermal conductivity data market is expected to complete more rapid growth.
